Thermal Stress chambers are a special type of thermal cycling chamber designed to subject products to mechanical stress by applying very fast temperature changes to the product. This stress causes any under-lying weaknesses to fail allowing poor quality products to be screened out before being shipped to the end customer.

ETS are able to offer for sale a second user VÖTSCH Thermal Shock chamber, a specialist floor standing chamber designed for Thermal Shock testing using one hot one cold and a basket to move the products between.

Manufactured to meet:

MIL STD 883E Method 1010.7 (A, B, C, D, F)
MIL STD 810E Method 503
MIL STD 202F Method 107 G
IEC 60068-2-14 Test Na
BS2011
DIN 40046 Test Na
JESD22 - A101-A